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Power Converter PCB Thermal Conductive Adhesive , Glass Fiber Backing Pressure Sensitive Acrylic Adh

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Power Converter PCB Thermal Conductive Adhesive , Glass Fiber Backing Pressure Sensitive Acrylic Adhesive

 

 

The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.

 


Features


> Thermal Conductivity: 1.0 W/mK
> High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive

 

Applications


> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive 
> Can be used instead of heat cure adhesive,screw mounting or clip mounting

 

Typical Properties of TIA™800FG Series
Product Name TIATM805FG TIATM806FG TIATM808FG TIATM810FG TIATM815FG TIATM820FG  Test  Method
Color White Visual
Adhesive Type Acrylic Adhesive ********
Backing Type Glass fiber ********
Composite Thickness 0.005" 0.127mm 0.006" 0.152mm 0.020" 0.203mm 0.010" 0.254mm 0.015" 0.381mm 0.020" 0.508mm ASTM D374

Aluminum Foil

Thickness

±0.001"  ±0.025mm ±0.001"  ±0.025mm ±0.0012" ±0.03mm ±0.0012" ±0.03mm ±0.0015" ±0.038mm ±0.002"  ±0.05mm

ASTM D374

Voltage Breakdown > 2000 Vac > 2000 Vac > 2300 Vac > 3000 Vac > 3500 Vac > 3500 Vac ASTM D149
Peel Adhesion 1200 g/inch2 JIS K02378

Holding Power

25/Days

> 120 kg/inch2 JIS K023711
Holding Power 120/Hours > 10 kg/inch2 JIS K023711
Recommend Using Pressure 10 psi ********
Thermal Conductivity 1.0 W/mK ********

Thermal

Impedance@50psi

0.52-in²/W 0.59-in²/W 0.83-in²/W 0.91-in²/W 1.15-in²/W 1.43-in²/W ASTM D5470

Power Converter PCB Thermal Conductive Adhesive , Glass Fiber Backing Pressure Sensitive Acrylic Adh
 
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